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  1. Página de inicio
  2. Tecnologias Wireless
  3. Embedded Wireless
  4. TELIT Embedded Wireless

3990252104

TELIT
TELIT 3990252104

La imagen puede diferir del original

Description: FN980 INTERFACE KIT EVB Fabricante: TELIT Código de coincidencia (matchcode): FN980IF TLBRevF w REvHmodule Rutronik No.: IOTCOM1155 Unidad de embalaje: 1 MOQ: 1 Presentación: INDIVIDUAL
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Download the free Library Loader to convert this file for your ECAD Tool

Por favor inicie sesión o regístrese para obtener información de precios personalizados, plazos de entrega y disponibilidad en tiempo real
WLAN
NONE
BLUETOOTH
NONE
CELLULAR
5G
802.15.4
NONE
SIGFOX
N Y/N
LORA
N Y/N
ANT
N Y/N
GNSS
GNSS
Automoción
NO
RoHS Status
RoHS-conform
Embalaje
INDIVIDUAL
ECCN
EAR99
Número de tarifa aduanera
85437090990
País
China
Clave-ABC
A
Plazo de entrega del proveedor
20 Semanas

For development purposes, please use the FN980 Interface Board together with Telit's Motherboard EVB (Rutronik Order Code: GSM1797).


This Interface Board Kit includes:

- 4 x LTE/5G Sub-6 Antennas

- 1 x FN980 Module (Telit FN980AAWW01T210100 / Rutronik Order Code: IOTCOM1156) mounted on the Interface Board



General Product Description:

This Interface Board is custom designed to interface the Telit module variant FN980 with the Telit Generic Evaluation Board (EVB) thus forming the complete Development Kit of FN980.

The TLB provides the mapping of Telit module signals and functions into the generic EVB signals and functions.


The FN980 TLB design includes the following items:

• FN980 module

• RF SMA connectors

• Board to Board connectors for interfacing to EVB main board

• Module specific circuitry which is not part of the generic circuitry of the EVB


The TLB also makes provision to assemble a custom designed module socket instead of assembling the module.

Power supply and control interface for the RF module is provided from the EVB via the B2B connectors.

To monitor the temperature, a thermistor is placed on the top GND plane, close to the module which should be representative for the module’s backside temperature.

The bottom plane solder-mask is cutout below the RF module in order to optimally mount/attach a heatsink aiming to cool the module via the many heat conducting GND via’s.

The board is designed to accommodate new modules according FN980 M.2 (50 x 30.00 x 3.40mm, +/- 0.15 mm tolerance and 75 pins) updated pin mapping.


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