IM69D130V01XTSA1
IM69D130V01XTSA1
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- Interface
- PDM
- Port location
- Bottom
- AOP
- 130 dBSPL
- SNR
- 69 dB
- Encapsulado
- LGA-5
- Automoción
- NO
- Technology
- MEMS
- Mounting
- SMD
- Footprint
- 12 mm²
- RoHS Status
- RoHS-conform
- Embalaje
- REEL
- Artículo fabricante
- SP001676962
- ECCN
- EAR99
- Número de tarifa aduanera
- 85423911000
- País
- China
- Clave-ABC
- B
- Plazo de entrega del proveedor
- 32 Semanas
High performance digital XENSIVTM MEMS microphone
Description
The IM69D130 is designed for applications where low self-noise (high SNR), wide dynamic range, low distortionsand a high acoustic overload point is required.
Infineon's Dual Backplate MEMS technology is based on a miniaturized symmetrical microphone design, similar
as utilized in studio condenser microphones, and results in high linearity of the output signal within a dynamic
range of 105dB. The microphone distortion does not exceed 1% even at sound pressure levels of 128dBSPL. The
flat frequency response ( 28Hz low-frequency roll-off) and tight manufacturing tolerance result in close phase
matching of the microphones, which is important for multi-microphone (array) applications.
With its low equivalent noise floor of 25dBSPL (SNR 69dB(A)) the microphone is no longer the limiting factor in
the audio signal chain and enables higher performance of voice recognition algorithms.
The digital microphone ASIC contains an extremely low-noise preamplifier and a high-performance sigma-delta
ADC. Different power modes can be selected in order to suit specific current consumption requirements.
Each IM69D130 microphone is calibrated with an advanced Infineon calibration algorithm, resulting in small
sensitivity tolerances (± 1dB). The phase response is tightly matched (± 2°) between microphones, in order to
support beamforming applications.
• Dynamic range of 105dB
- Signal to noise ratio of 69dB(A) SNR
- <1% total harmonic distortions up to
128dBSPL
- Acoustic overload point at 130dBSPL
• Sensitivity (± 1dB) and phase (± 2° @1kHz)
matched
•Flat frequency response with low frequency roll off
at 28Hz
• Very fast analog to digital conversion speed (6μs
latency @1kHz
•Power optimized modes determined by PDM
clock frequency
•Package dimensions: 4mm x 3mm x 1.2mm
•PDM output
•Omnidirectional pickup pattern
• Devices with Voice User Interface (VUI)
- Smart speakers
- Home automation
- IOT devices
• Active Noise Cancellation (ANC) headphones and
earphones
• High quality audio capturing
- Conference systems
- Cameras and camcorders
• Industrial or home monitoring with audio pattern
detection